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Review of Scientific Instruments / Volume 76 / Issue 6 / SPECIAL TOPIC: COMBINATORIAL INSTRUMENTS AND TECHNIQUES

Rev. Sci. Instrum. 76, 062221 (2005); http://dx.doi.org/10.1063/1.1921552 (7 pages)

Plasma sputtering system for deposition of thin film combinatorial libraries

James S. Cooper, Guanghai Zhang, and Paul J. McGinn

Department of Chemical and Biomolecular Engineering and Center for Molecularly Engineered Materials, University of Notre Dame, Notre Dame, Indiana 46556

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(Received 26 October 2004; accepted 3 April 2005; published online 26 May 2005)

The design of a plasma sputtering system for the deposition of combinatorial libraries is described. A rotating carousel is used to position shadow masks between the targets and the substrate. Multilayer films are built up by depositing sequentially through various masks. Postdeposition annealing is used to promote interdiffusion of the layered structures. Either discrete or compositional gradient libraries can be deposited in this system. Samples appropriate for characterization with a scanning electrochemical microscope or a multichannel microelectrode array system can be produced. The properties of some deposited Pt–Ru films for fuel cell applications are described.

© 2005 American Institute of Physics

Article Outline

  1. INTRODUCTION
  2. SYSTEM DESIGN
    1. Library synthesis
  3. MASK DESIGNS
  4. EXAMPLE FILM PROPERTIES
  5. DISCUSSION

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KEYWORDS and PACS

Keywords

sputter deposition, thin films, annealing, chemical interdiffusion

PACS

  • 81.15.Cd

    Deposition by sputtering

  • 81.40.Gh

    Other heat and thermomechanical treatments

  • 66.30.Ny

    Chemical interdiffusion; diffusion barriers

  • 68.55.A-

    Nucleation and growth

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.1921552

PUBLICATION DATA

ISSN

0034-6748 (print)  
1089-7623 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

For access to fully linked references, you need to log in.
    H. Chang, I. Takeuchi, and X. D. Xiang, Appl. Phys. Lett. 74, 1165 (1999)APPLAB000074000008001165000001.

    I. Takeuchi et al., J. Appl. Phys. 90, 2474 (2001)JAPIAU000090000005002474000001.


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